| 摘要 |
PROBLEM TO BE SOLVED: To realize a method of manufacturing a printed wiring board, whereby a solder resist layer of a high-density board can be produced at a high accuracy, low cost and short lead time. SOLUTION: The method of manufacturing a printed wiring board having at least an insulative base 31, and conductor layer 32 comprises steps of forming a solder resist material layer 35 on the printed wiring board, and irradiating a laser beam 37 on the solder resist material layer 35 according to a pattern of the solder resist layer. The pattern of the solder resist layer is formed by the machine control of a laser irradiator and on-off control/scan control of the laser beam and hence applicable to a high-accuracy and high-density printed wiring board. The pattern of the solder resist layer by the laser beam irradiator can be made by directly giving pattern data to the laser beam irradiator, and hence is economical because of no need to make a mask film, thereby reducing the lead time. |
