| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrostatic chuck which is superior in flatness of a chucking face, can stably and accurately vacuum- chuck a semiconductor wafer, etc., and not contaminating the semiconductor wafer with particles, etc. SOLUTION: In a method of manufacturing an electrostatic chuck whereby another surface of an electrostatic chuck part C1 having a plain electrode 3 at least one surface of which is covered with an insulator 3 having a vacuum chucking face 5 at the surface is pressed and bonded through a bond layer 7 to a base board 6 of an apparatus, the electrostatic chuck part C1 is made such that both surfaces are previously machined to a specified thickness, the bond face of the base board 6 is machined into a slightly concave recessed shape and pressed and bonded to the base board 6 of the apparatus.</p> |
