| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, which can readily detect the stress on a semiconductor chip. SOLUTION: This is a semiconductor device, which is formed by mounting a semiconductor chip 1 on a substrate 5. A plurality of distortion detecting elements 3 for detecting the distortion of the semiconductor chip 1 are formed an the specified parts in the semiconductor chip 1 in the same direction. Electric signals are applied on the distortion detecting elements 3. At the same time, an electrode 2 for taking out the output from one distortion detecting element 3 to the outside is formed. On the substrate 5, a measuring terminal 6 for connection to the electrode 2 is formed. The measuring terminal 6 and the electrode 2 are connected. |
