| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost non-contact IC card module which is small in module thickness and incorporates a breakless capacitor and its manufacture. SOLUTION: This module consists of a capacitor incorporated substrate where an IC 7 can be mounted, the IC 7, and a substrate where a coil 4 for an antenna is formed and the capacitor 6 is formed by vapor-deposition, sputtering, etc., on the substrate where the IC 7 is mounted, so the thickness of the capacitor 6 is several microns, or thin, so that a thin capacitor incorporated substrate can be obtained. The IC 7 is mounted on this capacitor incorporated substrate and the coil 4 for the antenna 7 is mounted to obtain the low- cost non-contact IC card module which is small in module thickness and never breaks. |
