| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for treating surface of a terminal of a semiconductor package, capable of preventing corrosion at a bent section of the terminal. SOLUTION: Through a method for treating surface, a terminal 1 projecting from a sealed semiconductor package mold is bent and coated by a hole sealing treatment chemicals. The projecting terminal 1 is plated with a solder, PD system, Sn, or Sn system alloy before the bending process. Even if cracks are generated on the plated surface of the terminal through the bending process, the hole sealing treatment chemicals can prevent the terminal from corrosion at the cracked part.</p> |
