| 摘要 |
<p>PROBLEM TO BE SOLVED: To remarkably improve reliability of chip resistor mounting with soldering, by forming auxiliary upper electrode films on the upper surfaces on both upper electrode films with which at least a cover coat do not overlap, so that thickness of the auxiliary upper electrode films is thicker than that of the upper electrode films. SOLUTION: In a chip resistor 10, auxiliary upper electrode films 17 are formed on the upper surfaces on both upper electrode films 12 with which at least a secondary cover coat do not overlap, so that thickness of the auxiliary upper electrode films 17 is thicker than that of the upper electrode films 12. The thicker auxiliary upper electrode films 17 can prevent the chip resistor 10 from being lifted from a printed wiring board B at one end so as to tilt to the other end due to a large gap between both auxiliary upper electrode films 17 and wiring patterns B1, B2 on the upper surface of the printed wiring board B in mounting the chip resistor to the wiring patterns B1, B2 on the upper surface of the printed wiring board B after placing the chip resistor 10 face down on the printed wiring board B.</p> |
