SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package with high electrical reliability by improving the reliability in electrical connection and strength in mechanical connection between a bump electrode formed at the terminal of a ceramics substrate and the terminal of a resin wiring board, which is capable of preventing poor connection. SOLUTION: For a ceramics/resin composite semiconductor package, a bump electrode 22 is formed at a terminal 21C of a ceramics substrate 21, while the bump electrode 22 provided with an acicular part 22T formed into acute shape. Through hot press-fitting by which the ceramics substrate 21 is laminated to a resin wiring board 24, the acicular part 22T of the bump electrode 22 penetrates a sheet-like adhesive layer 23 and sticks in the terminal 24C of the resin wiring board 24.