| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture a resin encapsulated semiconductor device with small pitches and many pins, while keeping the high reliability of a resin package. SOLUTION: In this manufacturing method, outer leads 5 of a lead frame 1 are coupled to each other with resin tie-bars 8 comprising polyether amide resin, polyether imide resin, polyether amide imide resin, or acrylic resin and a semiconductor chip is then mounted on a die pad 3 and encapsulated with a package of epoxy resin. Next, the device is immersed for three to five minutes in an organic solvent comprising dimethyl formaldehyde, dimethyl acetic amide, dimethyl sulfoxide, N-methyl-2-pyrrolidone, m-cresol, pyridine, or cyclohexane, of which the temperature is maintained in the range of 60 to 90 deg.C. This process enables burrs of the package together with these as of the resin tie-bars to be removed. |
