| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a substrate treating device in top view. SOLUTION: A substrate treating device consecutively treats a substrate and has a multistage oven 20a and a rotable robot. In the multistage oven 20a, conveyer rooms 21 and 26 for carrying in and out, a heating room 25a, and the like are overlapped in up and down directions. The conveyer rooms 21 and 26 are used for carrying in and out the substrate. The heating room 25a and the like are used for treating the substrate. The rotable robot moves the substrate between the conveyer rooms 21 and 26 for carrying in and out, the heating room 25a, and the like. |
