| 摘要 |
<p>PROBLEM TO BE SOLVED: To allow proper and stable operation of an electronic component for an extended period by effectively preventing the electronic component which is housed in a vessel from affected by electromagnetic wave, while the electronic component is sealed up airtight inside the vessel with no degraded characteristics. SOLUTION: While an insulating substrate 1, wherein comprising a mounting part 1a with an electronic component 3 mounted on its upper surface, a metal layer 8 is allocated below the electronic component mount part 1a, and a conductive lid 2 are made to joint via a conductive sealing material 9 and the metal layer 8, and the conductive lid 2 are electrically connected, the electronic component 3 is housed airtight inside the vessel 4 comprising the insulating substrate 1 and the conductive lid 2. For the conductive sealing material 9, a glass component contains an inorganic filler and a metal filler, with the particle size of the metal filler being larger than that of the inorganic filler.</p> |
