发明名称 |
ELECTRODEPOSITION TREATMENT EQUIPMENT AND METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of pits on an electrodeposited resist by dividing an electrodeposition bath in the progressing direction of a material to be electrodeposited and providing at least one electrodeposition solution communication blocking body consisting of a nonconductor having an opening part. SOLUTION: An electrodeposition bath 120 is divided into a plurality of divisions 121-123 in the progressing direction of a material 110 to be electrodeposited to almost block the communication of electrodeposition solution 140 in each division, and at least one of electrodeposition solution communication blocking bodies 161-163 is provided. In each of the divisions 121-123 divided by the electrodeposition solution communication block bodies 161-163, each electrode 130 separated by sections is provided for all or part of the sections so as to independently apply a desired electrodeposition voltage through division. Furthermore, an electrodeposition voltage can be adjusted for electrodeposition and the generation of bubbles due to electrolysis can be controlled to be less. As a result, adhesion of bubbles on the material to be electrodeposited can be reduced, and the generation of pits on an electrodeposited resist can be reduced. |
申请公布号 |
JPH11274389(A) |
申请公布日期 |
1999.10.08 |
申请号 |
JP19980093917 |
申请日期 |
1998.03.24 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
SUZUKI KOJI;ONOZAWA KIYOSHI;KOTANI KEIICHI;MOMOSE TERUHISA;SAKIHAMA NOBUHIRO |
分类号 |
H01L23/50;C25D5/02;C25D7/12;C25D13/00;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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