发明名称 ELECTRODEPOSITION TREATMENT EQUIPMENT AND METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To suppress the generation of pits on an electrodeposited resist by dividing an electrodeposition bath in the progressing direction of a material to be electrodeposited and providing at least one electrodeposition solution communication blocking body consisting of a nonconductor having an opening part. SOLUTION: An electrodeposition bath 120 is divided into a plurality of divisions 121-123 in the progressing direction of a material 110 to be electrodeposited to almost block the communication of electrodeposition solution 140 in each division, and at least one of electrodeposition solution communication blocking bodies 161-163 is provided. In each of the divisions 121-123 divided by the electrodeposition solution communication block bodies 161-163, each electrode 130 separated by sections is provided for all or part of the sections so as to independently apply a desired electrodeposition voltage through division. Furthermore, an electrodeposition voltage can be adjusted for electrodeposition and the generation of bubbles due to electrolysis can be controlled to be less. As a result, adhesion of bubbles on the material to be electrodeposited can be reduced, and the generation of pits on an electrodeposited resist can be reduced.
申请公布号 JPH11274389(A) 申请公布日期 1999.10.08
申请号 JP19980093917 申请日期 1998.03.24
申请人 DAINIPPON PRINTING CO LTD 发明人 SUZUKI KOJI;ONOZAWA KIYOSHI;KOTANI KEIICHI;MOMOSE TERUHISA;SAKIHAMA NOBUHIRO
分类号 H01L23/50;C25D5/02;C25D7/12;C25D13/00;(IPC1-7):H01L23/50 主分类号 H01L23/50
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