| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package by which bonding failure between the terminals for wire bonding arranged on a resin wiring board, bonding wires can be prevented and defective adhesion between the resin wiring board, and an adhesive layer be eliminated. SOLUTION: A semiconductor package using ceramics/resin compound board is provided with an adhesive layer 20 to adhere a ceramics board 10 to a resin wiring board 30, which is formed of a plurality of adhesive layers 20H and 20L having two or more kinds of glass transition points. The glass transition point of the adhesive layer 20H is high, and it is formed in the region of a wire bonding terminal 34P. The glass transition point of the adhesive layer 20L is low, and it is formed in the other regions, especially around the semiconductor package. |
