| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit device, wherein a bonding wire itself which connects a connection terminal supported by a resin frame surrounding a wiring board to a bonding pad of the wiring board does not rupture or peels off a connection part for high connection reliability, even if a situation wherein operation atmosphere is easy to be high temperature with abrupt temperature change is repeated over for an extended period. SOLUTION: A hybrid integrated circuit device 1 comprises a wiring board 3 attached to a heat sink 2, a frame 4 surrounding the wiring board 3 provided in the peripheral part of the heat sink 2, a lid stopping an opening part of a housing space of the frame 4 and the wiring board 3, and a connection terminal 7, in which being supported by the frame 4, its one end is electrically connected to a bonding wire 6 and a bonding pad 5 of the wiring board 3. The frame 4 comprises a material whose thermal expansion coefficient in a direction which is at least parallel to the connection direction of the bonding wire 6 being 25×10<-6> /C deg. or below. |
