| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip mounting method, which can securely prevent generation of voids in a solder ball after reflow. SOLUTION: In the chip mounting method which mounts a chip 14 having a plurality of connecting solder balls 16 on a plurality of plated flip-chip pads 13 in a package substrate 11, flux 17 is applied on the flip-chip pads 13. Then, a chip 14 is arranged for the package substrate 11 so that the solder balls 16 are in contact with the end part 13d of the flip-chip pad 13. Then, after the solder ball 16 is pushed to the end part 13d of the flip-chip pad and temperarily fixed, reflow processing is performed.</p> |
