| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability and productivity of a semiconductor package mounted on small portable equipment, etc., by forming ruggedness on the surface of an organic resin which covers an IC chip for protection. SOLUTION: The reliability and the productivity of a semiconductor package mounted on small portable equipment, etc., are improved by manufacturing the semiconductor package, through roughening the surface of an organic resin 4 such as polyimide, which covers the surface of an IC chip for protection, connecting the IC chip 9 to a circuit board 10, and encapsulating the surface of the IC chip with a liquid encapsulating resin 12. Since the structure of the semiconductor package has ruggedness on the organic resin 4 of the IC chip 9, adhesion between the organic resin 4 and the encapsulating resin 12 is strengthened, and moisture resistance is improved. Since the roughening process is performed in the wafer status, the batch-process of the surface of the IC chips can be performed. The surface can be easily roughened to have ruggedness by reactive ion etching. |
