| 摘要 |
PROBLEM TO BE SOLVED: To simplify a multilayer process, reduce a via hole occupation space, and to increase density by forming integrally the multilayer wiring layer part of a laminate film and a core substrate. SOLUTION: When upper and lower wiring patterns 5 are connected via at least two interlayer insulation films, via holes 3 and 4 that penetrate at least two interlayer insulation films are provided and are connected directly, thus reducing the occupation space of the via holes 3 and 4 and hence increasing density. A laminate film 6 for constituting a multilayer wiring part 1 is made of a resin film 7 that becomes the interlayer insulation film and a metal thin film 8. Then, for simplifying the succeeding formation process of the wiring patterns 5, a resin film 9 that becomes a pattern formation mask is provided on the surface of the metal thin film 8, thus simplifying a multiple-stage build-up process and directly connecting the wiring pattern to a Cu via of being filled into a via hole through the interlayer insulation film with at least two layers and hence reducing the occupation space of the via. |
