| 摘要 |
PROBLEM TO BE SOLVED: To enable conducting heat from a device to the outside of a package by using a film substratum formed of diamond, while avoiding damage of the device due to thermal deviation, in a package of an electronic circuit. SOLUTION: A package 10 for an electronic circuit device of a type having a metal laminated style base flange 12 formed of molybdenum whose both sides are covered with copper has a film substratum 32 formed of CVD diamond, which is inserted in a hollow in a bottom part of a base flange 12. The substratum 32 is flush with the surface of the base flange 12. An aperture 40 of the base flange 12 of the opposite side forms a chamber together with the substratum 32 formed of diamond, and a device 28 can be closely bonded to the substratum 32 formed of diamond. |
