| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of laying a die which enables easy control of the quantity of an adhesive for use. SOLUTION: This method is constituted of a step of supplying a die with a supply source 26 of an adhesive 28 for laying a die, a step of giving a part of the adhesive for laying a die to a transfer member 32, a step of bringing the outside of a lead frame 16 into contact with the transfer member, and printing the layer of the adhesive on the outside of the lead frame. According to this method, a bonding line with a specified uniform thickness can be obtained as a result, and the adhesive at die laying can be minimized, and the die laying adhesive is prevented from spreading to the flank of the die. |
