发明名称 DRY ETCHING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To prevent the clogging by the waste gaseous material in a waste gas treating section 24 by a solid collecting section and to prevent the outflow of volatile components from the solid collecting section when a treating section bypass stop valve of the waste gas treating section opens. SOLUTION: The solid collecting section 23 and the waste gas treating section 24 are successively arranged in a discharge line 22 of a dry etching section 21. A collecting section bypass line 44 having a collecting section bypass stop valve 45 is connected in parallel with the solid collecting section 23. A treating section bypass line 54 having the treating section bypass stop valve 55 is connected in parallel with the waste gas treating section 34. An inlet side stop valve 41 and an outlet side stop valve 42 are arranged in the inlet and outlet of the solid collecting section 23. A control section 46, which closes the inlet side stop valve 41 and the outlet side stop valve 42 when the treating section bypass stop valve 55 opens, is provided.</p>
申请公布号 JPH11271809(A) 申请公布日期 1999.10.08
申请号 JP19980078142 申请日期 1998.03.25
申请人 TOSHIBA ELECTRONIC ENGINEERING CORP;TOSHIBA CORP 发明人 ABE HIROTSUGU
分类号 H01L21/302;G02F1/136;G02F1/1368;H01L21/3065;(IPC1-7):G02F1/136;H01L21/306 主分类号 H01L21/302
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