发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME
摘要 PROBLEM TO BE SOLVED: To ensure both good i-line transmittance and low residual stress after imidation, to give a high resolution pattern of a good shape and to form a polyimide film having good mechanical characteristics and high heat resistance by incorporating a polyimide precursor having specified repeating units. SOLUTION: A polyimide precursor having repeating units represented by formula I is incorporated. In the formula I, X is a tetravalent org. group, Y is a tri- or higher valent org. group, R<1> is a group represented by formula II, R<2> and R<3> are each hydroxyl or a monovalent org. group and (m) is >=1. In the formula II, Z is a group contg. a photo- or thermopolymerizable C-C double bond. The polyimide precursor can be produced by a known production process and can be synthesized, e.g. by synthesizing a polyamic acid from a tetracarboxylic acid dianhydride and amine compds. including triamine in an org. solvent and allowing a carboxylic acid having a thermo- or photopolymerizable double bond or its anhydride to react with the amino residues of the synthesized polyamic acid.
申请公布号 JPH11271973(A) 申请公布日期 1999.10.08
申请号 JP19990006354 申请日期 1999.01.13
申请人 HITACHI CHEM CO LTD 发明人 SASAKI AKIHIRO
分类号 G03F7/038;C08G73/16;C08L79/08;C09D5/00;H01L21/027;H01L21/312;H01L21/768;H01L23/522;(IPC1-7):G03F7/038 主分类号 G03F7/038
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