| 摘要 |
A conductor (112), a method for forming the conductor (112), and a method for attaching a discrete circuit device, such as a bond pad, chip capacitor, chip resistor, etc., to the conductor (112) with solder connections (16). Solder connections (16) formed by the method are characterized as being accurately located on the conductor (112) and having a shape and location that achieves an adequate and uniform stand-off height for the device, and improves thermal cycle fatigue life. Such benefits are achieved by forming a nonsolderable layer (114) on a substrate (10), and then forming a solderable conductor (112) on the substrate (10) such that a first portion of the conductor (112) overlies the nonsolderable layer (114) and a second portion of the conductor (112) does not overlie the nonsolderable layer (114). In so doing, the first and second portions of the conductor (114) define a boundary therebetween beyond which solder deposited on the second portion of the conductor (112) is inhibited from flowing onto the first portion of the conductor (112).
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