| 摘要 |
A mail item is disclosed comprising a cover for carrying contents and formed of flexible electrically insulating material. The cover acts as a substrate on which semi-conductor elements and electrical connections are formed or deposited. The electronic circuit comprises semi-conductor elements interconnected to provide at least a memory and an interface to said memory and electrical connections are formed to be flexible. Mail handling apparatus is disclosed for communicating with the interface of the mail item and for writing information to and reading information from the memory via the interface.
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