| 摘要 |
PROBLEM TO BE SOLVED: To reduce the consumption of an abrasive slurry and improve the polished product by forming a groove having a prescribed width on an abrasive pad, and forming, within the groove, at least one resistor for raising the resistance when a liquid is carried in the extending direction of the groove. SOLUTION: A lattice groove 21 is formed on an abrasive pad base 20. A resistor for raising the resistance when a liquid is carried in the extending direction of the groove is formed in the groove 21. When an abrasive slurry is carried within the groove 21 in the extending direction of the groove, the resistance is raised to prevent the slurry from being carried out at once in discharge, so that the opportunity of the contact with a wafer can be increased. As the resistor in the groove 21, ribs 31 are formed at equal intervals in the groove 21 formed on the abrasive pad. The groove 21 is divided by the ribs 31 into a plurality of recessed parts 32 arranged in the extending direction of the groove. The abrasive slurry is caught in the divided recessed parts 32 without being carried out at ounce in the discharge along the groove 21, whereby the opportunity of the contact with the wafer can be increased. |
