Testing attachment reliability of devices

摘要

An apparatus for testing the attachment reliability of a device mounted at least by an electrically conducting joint to a surface of a circuit board is provided. The apparatus includes an environmental chamber in which the board can be placed; an actuator for applying a force to the device; an electrical monitoring unit for monitoring any events at the electrically conducting joint; and a memory unit for storing an event profile that includes information related to the events. The apparatus may further include a processing unit for characterizing the quality of the electrically conducting joint based on the stored event profile and for performing various other functions. A method for testing the attachment reliability of the device is also provided.