| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid thermosetting composition used for filling, capable of being thermally cured in small contraction, permitting the easy removal of the unnecessary portions of a cured product by a physical grinding method after preliminarily cured, and giving a cured product having low hygroscopicity, excellent adhesivity, excellent PCT resistance, etc., and to provide a method for permanently filling a printed circuit board with the composition. SOLUTION: This composition comprises (A) an epoxy resin liquid at room temperature, (B) a phenolic resin liquid at room temperature, (C) a curing catalyst and (D) an inorganic filler. The method for permanently filling a printed circuit board with the composition comprises filling a hole portion, such as a via hole, of the printed circuit board with the composition, thermally pre- curing the filled composition, grinding off a pre-cured composition portion protruded from the surface of the hole portion, and subsequently mainly thermally curing the filled composition. |
