发明名称 PLATE FOR LAMINATED PLATE MOLDING AND LAMINATED PLATE
摘要 PROBLEM TO BE SOLVED: To manufacture a plate for a laminated plate molding for carrying out the heat and pressure molding for a metal-clad laminated plate by connecting a power source, by applying power to the metal foil to heat the metal foil, making the dimensional behavior of the laminated plate thus manufactured equal to that of the laminated plate manufactured by the conventional not press molding to enable a use to use the laminated plate thus formed similar to the laminated plate manufactured by the conventional hot press molding and improving the molding properties of the laminate to be manufactured. SOLUTION: Insulated layers 3 are formed integrally on both faces of a metal plate 2 having the 0.3-2.0 mm thickness and 9-18 ppm coefficient of thermal expansion. The surface roguness of the insulating layer 3 is formed as 5μm or less. The thermal expansion coefficient of the whole is set at 9-18 ppm. A laminated plate having the dimensional behavior equal to that of the laminate manufactured by the hot press mold available heretofore can be manufactured by using a laminate molding plate thus formed.
申请公布号 JPH11268185(A) 申请公布日期 1999.10.05
申请号 JP19980079378 申请日期 1998.03.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ICHIKI TSUTOMU;MISAWA HIDETO;MORI HIROYUKI;AOI MASAKAZU
分类号 B32B15/20;B29C43/20;B29C43/32;B29L9/00;B32B15/08;(IPC1-7):B32B15/20 主分类号 B32B15/20
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