发明名称 |
Semiconductor device and method for forming the same |
摘要 |
A thin film transistor device incorporates a silicide film contacting the source and drain. The silicide layer substantially reduces parasitic resistance between the source and drain of the device, improving the performance of the TFT. The silicide layer may be formed by covering the silicon semiconductor with a metal and irradiating the metal with a laser to initiate a reaction with the adjacent silicon to produce a silicide film. The layer may also be formed by rigidly adhering a metal coating to the exposed source and drain regions using a triangular-shaped insulator, and allowing the metal to react with silicon.
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申请公布号 |
US5962897(A) |
申请公布日期 |
1999.10.05 |
申请号 |
US19970886139 |
申请日期 |
1997.06.30 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
TAKEMURA, YASUHIKO;ZHANG, HONGYONG;TERAMOTO, SATOSHI |
分类号 |
H01L21/336;H01L21/70;H01L21/77;H01L21/84;H01L27/12;H01L29/45;H01L29/49;H01L29/772;H01L29/78;H01L29/786;(IPC1-7):H01L27/01;H01L29/76;H01L29/94;H01L31/062 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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