发明名称 |
Wire bonding method |
摘要 |
A method for connecting a first bonding point and a second bonding point with a wire comprising the steps of: raising a capillary through which the wire passes slightly after the second reverse operation that involves the movement of the capillary in the opposite direction from a second bonding point, moving the capillary to a position which is more or less above the first bonding pint, and then raising the capillary while delivering the wire; resulting in the formation of a kink in the inclined portion of a trapezoidal wire loop employed in the wire connection in semiconductor devices.
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申请公布号 |
US5961029(A) |
申请公布日期 |
1999.10.05 |
申请号 |
US19980005789 |
申请日期 |
1998.01.12 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
NISHIURA, SHINICHI;MOCHIDA, TOORU |
分类号 |
H01L21/60;B23K20/00;H01L21/607;(IPC1-7):B23K31/02;B23K1/06 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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