发明名称 CUTTING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent chips (contaminants) from adhering on the surface of a work as much as possible, in the case of a work being cut as cutting water is supplied in a cutting device. SOLUTION: This cutting device comprises a chuck table 11 to hold a work and be rotatable; a cutting means 13 to perform cutting as cutting water is supplied to a work held at the chuck table 11. In this case, a direction being a direction in which the chuck table is moved is set to the direction of an X-axis, and a dividing feed direction being a direction in which a cutting means is moved is set to the direction of a Y-axis. When the rotation center 20 of the chuck table is the home position of the Y-axis, the cutting means is positioned in a minus region a region on the minus side based on a home position, and a curtain nozzle 22 to form a fluid curtain between the work and the curtain nozzle through injection of fluid is disposed in parallel to an X-axis in a plus region being a region on the plus side.</p>
申请公布号 JPH11267940(A) 申请公布日期 1999.10.05
申请号 JP19980075335 申请日期 1998.03.24
申请人 DISCO ABRASIVE SYST LTD 发明人 NAMIOKA SHINICHI;ISHII SHIGERU
分类号 B23Q11/00;B24B55/06;B28D7/02;H01L21/301;(IPC1-7):B23Q11/00 主分类号 B23Q11/00
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