Solder, electronic component mounted by soldering, and electronic circuit board

摘要

PCT No. PCT/JP96/01680 Sec. 371 Date Dec. 19, 1997 Sec. 102(e) Date Dec. 19, 1997 PCT Filed Jun. 19, 1996 PCT Pub. No. WO97/00753 PCT Pub. Date Jan. 9, 1997The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).