发明名称 Methods for forming integrated circuit capacitors including dual layer electrodes
摘要 A method for forming an integrated circuit capacitor includes the steps of forming a first electrode layer on a substrate wherein the first electrode has a first dopant concentration, and forming a second electrode layer on the first electrode layer opposite the substrate. The second electrode layer has a second dopant concentration different from the first dopant concentration. In addition, a portion of the second electrode layer is converted to a hemispherical grain layer. More particularly, the first dopant concentration is greater than the second dopant concentration. Related structures are also discussed.
申请公布号 US5963805(A) 申请公布日期 1999.10.05
申请号 US19970884149 申请日期 1997.06.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, MAN-SUG;AHN, SEUNG-JOON
分类号 H01L27/108;H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L27/108
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