发明名称 |
Methods for forming integrated circuit capacitors including dual layer electrodes |
摘要 |
A method for forming an integrated circuit capacitor includes the steps of forming a first electrode layer on a substrate wherein the first electrode has a first dopant concentration, and forming a second electrode layer on the first electrode layer opposite the substrate. The second electrode layer has a second dopant concentration different from the first dopant concentration. In addition, a portion of the second electrode layer is converted to a hemispherical grain layer. More particularly, the first dopant concentration is greater than the second dopant concentration. Related structures are also discussed.
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申请公布号 |
US5963805(A) |
申请公布日期 |
1999.10.05 |
申请号 |
US19970884149 |
申请日期 |
1997.06.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, MAN-SUG;AHN, SEUNG-JOON |
分类号 |
H01L27/108;H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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