发明名称 Dissipating device for computer chips
摘要 The present invention relates to a dissipating device that uses a high-efficiency radiator for natural convection heat dissipation for a CPU (central processing unit) or an IC (integrated circuit) die with low cost. The radiator is formed by screen plates punched to form many tilted rhombus cells constructed by many wave-shaped mesh wires having a flat rectangular cross-section. The screen plates are made of good heat-conductive metal material. A plurality of the screen plates are overlapped in various orientations so that the heat dissipating effect can be improved, radiating heat through natural convection.
申请公布号 US5960863(A) 申请公布日期 1999.10.05
申请号 US19980004029 申请日期 1998.01.07
申请人 HUA, HSU MEI 发明人 HUA, HSU MEI
分类号 F28F3/02;H01L23/367;(IPC1-7):F28F3/02 主分类号 F28F3/02
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