| 摘要 |
A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die, integrated circuit (IC) chips, or other small components for automated assembly processing. The carrier tape system is comprised of a longitudinal elongated flexible punched carrier tape frame and a solid width of pressure sensitive adhesive (PSA) tape affixed to one side of the carrier tape frame. The punched carrier tape frame has a plurality of spaced apart aperture cavities therethrough. The solid width of PSA tape also has a plurality of spaced apart configured apertures which are smaller than the plurality of aperture cavities of the punched carrier tape frame. These configured apertures of the PSA tape are centrally aligned and respectively located within the aperture cavities of the carrier tape frame. The perimeter of each configured aperture has a plurality of small protruding tabs which extend inwardly into each configure aperture for receiving, retaining and quickly releasing the small components therein. These small protruding tabs minimize adhesive contact to the small components contained within the aperture cavities of the carrier tape frame, and thereby enable quick release of the small components from the aperture cavities.
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