发明名称 POWER LOSS RECOVERY FOR WAFER HEATER
摘要 <p>Apparatus comprises a power loss recovery mechanism for use with a semiconductor wafer heater assembly and has a) a pneumatic air cylinder and compressed air supply, the cylinder mechanically linked to the wafer drive assembly for moving the wafer heater assembly between an operating and non-operating process position; b) control valve normally closed during heater operation, and open during interruption to the electrical supply in order to move the heater assembly to a non-operative position. Also claimed is a process for recovery of power loss in a semiconductor wafer heater assembly to prevent damage to wafers under process during an electrical power failure, using a pneumatic actuator assembly claimed above. A mechanical assembly for power loss recovery similar to that claimed above, but utilising pneumatic motor to move the heater assembly instead of a pneumatic cylinder assembly is also claimed, together with a process using the equipment.</p>
申请公布号 KR100219968(B1) 申请公布日期 1999.10.01
申请号 KR19950003616 申请日期 1995.02.24
申请人 APPLIED MATERIALS, INCOPORATED 发明人 LAWRENCE C. LEI;GEAN, HSU
分类号 H01L21/302;H01L21/00;H01L21/22;H01L21/3065;H01L21/324;H01L21/687;(IPC1-7):H01L21/02 主分类号 H01L21/302
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