发明名称 |
POWER LOSS RECOVERY FOR WAFER HEATER |
摘要 |
<p>Apparatus comprises a power loss recovery mechanism for use with a semiconductor wafer heater assembly and has a) a pneumatic air cylinder and compressed air supply, the cylinder mechanically linked to the wafer drive assembly for moving the wafer heater assembly between an operating and non-operating process position; b) control valve normally closed during heater operation, and open during interruption to the electrical supply in order to move the heater assembly to a non-operative position. Also claimed is a process for recovery of power loss in a semiconductor wafer heater assembly to prevent damage to wafers under process during an electrical power failure, using a pneumatic actuator assembly claimed above. A mechanical assembly for power loss recovery similar to that claimed above, but utilising pneumatic motor to move the heater assembly instead of a pneumatic cylinder assembly is also claimed, together with a process using the equipment.</p> |
申请公布号 |
KR100219968(B1) |
申请公布日期 |
1999.10.01 |
申请号 |
KR19950003616 |
申请日期 |
1995.02.24 |
申请人 |
APPLIED MATERIALS, INCOPORATED |
发明人 |
LAWRENCE C. LEI;GEAN, HSU |
分类号 |
H01L21/302;H01L21/00;H01L21/22;H01L21/3065;H01L21/324;H01L21/687;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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