| 摘要 |
The invention concerns a method for electrical connection between an integrated circuit (10) housing connection pads (9i) and a CSP housing output terminals (18), which consists in connecting the integrated circuit (10) connection pads (9i) to a connecting support (1) arranged opposite and on a different level from the connecting pads (9i) via electrical conductors (8i) arranged on the connecting support (1). The method is characterised in that, after the support (1) has been arranged opposite the integrated circuit (10), it consists in moving at least part (7i) of the support to bring it in the proximity of the integrated circuit (10) connection pads (9i), and in connecting the conductors (8i) supported by the support part (7i) of the support (1) on the integrated circuit (10) connection pads (9i). The invention is particularly applicable to CSP housing interconnection technique (18). |
