PROCEDE DE FABRICATION DE CARTES A PUCE

摘要

The invention concerns a method for making a chip card comprising an interface for external communication and at least an electronic component (4) emerging at the surface. Said method is characterised in that it consists in connecting the electronic component (4) to the communication interface by means of conducting wires; temporarily fixing the electronic interface-electronic component assembly against a first plastic wafer (11); placing a second plastic wafer (23) on the electronic assembly, an opening (24) being provided either in the first wafer (11) or in the second wafer (23) to house the electronic component (4); and in making the two wafers (11 and 23) integral by closing the interface and the electronic component.