发明名称 PRECONDITIONING POLISHING PADS FOR CHEMICAL-MECHANICAL POLISHING
摘要 A polishing pad for CMP is rapidly preconditioned before actual use by impinging a stream of particles on the polishing surface. Embodiments of the present invention include linearly traversing an impinging jet stream of unagglomerated ceramic particles, e.g., silicon dioxide particles having a particle size of about 5 to about 50 nm, across the polishing surface of a rotating polishing pad to effect preconditioning in less than about 5 minutes.
申请公布号 US2001001738(A1) 申请公布日期 2001.05.24
申请号 US19990280253 申请日期 1999.03.29
申请人 PRABHU GOLPALAKRISHNA B. 发明人 PRABHU GOLPALAKRISHNA B.
分类号 B24B37/04;B24B53/013;(IPC1-7):H01L21/461;H01L21/302 主分类号 B24B37/04
代理机构 代理人
主权项
地址