发明名称 |
Electronic package with stacked connections and method for making same |
摘要 |
An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members. |
申请公布号 |
US2001001593(A1) |
申请公布日期 |
2001.05.24 |
申请号 |
US20010764467 |
申请日期 |
2001.01.17 |
申请人 |
ARMEZZANI GREGG J.;HELLER MATTHEW A. |
发明人 |
ARMEZZANI GREGG J.;HELLER MATTHEW A. |
分类号 |
H01L23/498;H05K3/36;(IPC1-7):H05K1/14 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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