发明名称 SUBSTRATE PROCESSING SYSTEM
摘要 A substrate processing system includes a primary processing assembly (500) and secondary processing assembly (510). The secondary processing assembly (510) has one or more interconnected modules (514, 516, 322, 502, 504, 524, 526, 540, 542) and includes one or more process stations (520, 530). The primary and secondary processing assemblies (500, 510) are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly (510) may include one or more modules (514, 516, 322, 502, 504, 524, 526, 540, 542) which are interconnected to provide a desired system configuration. A dual processing module (520), including first and second process stations, is selectably operable in a serial mode or a parallel mode.
申请公布号 WO0183843(A1) 申请公布日期 2001.11.08
申请号 WO2001US12246 申请日期 2001.04.13
申请人 INTEVAC, INC. 发明人 BLUCK, TERRY;HUGHES, JOHN, LES;LAWSON, ERIC, C.;TANAKA, TATSURU
分类号 C10M107/38;C10N40/18;C10N50/04;C23C14/06;C23C14/56;C23C16/26;C23C16/458;C23C16/54;G11B5/725;G11B5/84;G11B7/241;G11B7/254;G11B7/257;G11B7/26;G11B11/105;H01L21/00;(IPC1-7):C23C14/56 主分类号 C10M107/38
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