| 摘要 |
Electronic apparatus is disclosed having components mounted within an environmentally sealed external enclosure. The enclosure is made of heat conductive material and ones of the components are mounted in heat conductive association with one or more walls of the enclosure. At least one heat pipe has an evaporator in thermally conductive contact with a wall of the enclosure proximate a said one of the components. Its condenser is located outside the enclosure and is provided with thermally conductive fins. Components which generate large amounts of heat can thus be provided with additional cooling reducing local hot spots. The enclosure may be designed for the larger market in temperate climates, and to modified for hotter climates. <IMAGE> |
