发明名称 Modular moulding apparatus
摘要 <p>The invention relates to an apparatus for moulding lead frames. The means for introducing a lead frame into one of the mould halves, the means for carrying encapsulating material into the cavities of the mould and the means for removing an encapsulated product from the mould are arranged on at least one carriage movable along a guide relative to the mould halves, which carriage provided with means serves at least one mould. <IMAGE></p>
申请公布号 EP0713246(B1) 申请公布日期 1999.09.29
申请号 EP19950203144 申请日期 1995.11.16
申请人 FICO B.V. 发明人 HARMSEN, WILHELMUS H.J.
分类号 B29C45/40;B29C31/00;B29C37/00;B29C45/14;H01L21/00;H01L21/56;(IPC1-7):H01L21/00;B29C43/34 主分类号 B29C45/40
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