发明名称 |
Manufacture of a chip module |
摘要 |
<p>A chip module (37) includes a substrate (12) and at least one chip (38) arranged on the substrate, wherein the chip 5 (11) is contacted via its terminal surfaces onto connecting leads (14, 15) of the substrate (12) and has a thickness d which is reduced compared to its original thickness D as a result of a removal of material on its rear side (39).</p> |
申请公布号 |
EP0944922(A1) |
申请公布日期 |
1999.09.29 |
申请号 |
EP19970951116 |
申请日期 |
1997.12.11 |
申请人 |
FINN, DAVID;RIETZLER, MANFRED |
发明人 |
FINN, DAVID;RIETZLER, MANFRED |
分类号 |
B42D15/10;G06K19/077;H01L21/58;H01L21/60;H01L23/498;H01L25/00;(IPC1-7):H01L23/498 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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