METHOD OF RECYCLING SILICON SINGLE CRYSTAL WAFER WITH COPPER FILMS AND RECYCLED WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method of obtaining an etching liquid chemical composition capable of easily dissolving and removing a copper foil on a silicon single crystal wafer, thereby efficiently and surely removing it, and a recycling method for obtaining a silicon single crystal wafer having no copper contaminant. SOLUTION: The method of recycling a silicon single crystal wafer with deposited copper foils along a wafer recycled by this material comprises a least a step of dissolving and removing the copper foil with sulfuric acid- hydrogen peroxide liquid, and a step of polishing the copper-film-removed surface of the wafer into a mirror surface. A semiconductor wafer is recycled by this method.