发明名称 APPARATUS AND METHOD FOR HEAT TREATING PLATE-LIKE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for heat treating having no vibration on a material to be treated without delivering the material during heat treating, and to provide an apparatus for heat treating having a small heat loss, a small size and high accuracy in heat treating without depending upon the shape of the material. SOLUTION: The apparatus for heat treating comprises a material-to-be- treated heat treating plate 4 for placing a plate-like material P to be treated, and a radiation heater 3 for heating the material on the plate 4. At least one channels 4a, 40 are provided in the plate 4. A method for heat treating comprises the steps of distributing a heating medium to the channels 4a, 10, and stepwisely temperature changing the material P placed on the plate 4 by the heater 3 to heat treat the material.
申请公布号 JP2002158245(A) 申请公布日期 2002.05.31
申请号 JP20000354119 申请日期 2000.11.21
申请人 KOYO THERMO SYSTEM KK 发明人 HIURA ATSUSHI;TSUJI SOHEI
分类号 H01L21/26;H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/26
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