APPARATUS AND METHOD FOR HEAT TREATING

摘要

PROBLEM TO BE SOLVED: To improve safety by simplifying a structure at a low cost and decreasing the leakage amount of an H2 gas as much as possible. SOLUTION: An apparatus for heat treating treats a wafer in a hydrogen atmosphere of an atmospheric pressure. A method for heat treating comprises the steps of once performing evacuation into vacuum in a reaction tube 3, then filling a nitrogen gas under the atmospheric pressure, and thereafter filling the hydrogen gas therein.