发明名称 |
Capacitor production in an IC, especially for stacked capacitor production in a DRAM circuit |
摘要 |
An IC capacitor is produced by forming a conductive prop (7) in an alternate conductive and sacrificial layer sequence, removing the sacrificial layers and forming a dielectric (9) on the exposed surfaces. A capacitor is produced in an IC by: (a) coating a support (2) with a layer sequence of alternate conductive layers (61) and sacrificial layers; (b) forming an opening in the layer sequence; (c) forming an conductive prop structure (7) in the opening; (d) anisotropically etching the layer sequence to the lateral dimensions of the capacitor; (e) selectively removing the sacrificial layers; (f) forming a capacitor dielectric (9) on the exposed surfaces of the first material layers (61) and the prop structure (7); and (g) forming a counterelectrode (10) on the dielectric surface.
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申请公布号 |
DE19821776(C1) |
申请公布日期 |
1999.09.30 |
申请号 |
DE19981021776 |
申请日期 |
1998.05.14 |
申请人 |
SIEMENS AG |
发明人 |
LANGE, GERRIT;FRANOSCH, MARTIN;LEHMANN, VOLKER;REISINGER, HANS;SCHAEFER, HERBERT;STENGL, REINHARD;WENDT, HERMANN |
分类号 |
H01L21/8242;H01L27/108;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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