| 摘要 |
PROBLEM TO BE SOLVED: To provide both a flexible IC module which can be utilized for production of a noncontact type IC card or the like and a method for producing the same and to provide a method for producing an information carrier with the flexible IC module. SOLUTION: In the flexible IC module, an IC chip 1 and a coil 2 are buried by flexible substrates consisting of nonwoven fabric which has compression properties in the thickness direction, self-contact bonding properties and impregnation properties of resin. In the method for producing the flexible IC module, a first nonwoven fabric 12 having compression properties in the thickness direction, self-contact bonding properties and impregnation properties of resin is placed on a bottom force 11. The IC chip 1 and the coil 2 are positioned and placed on the first nonwoven fabric 12 and a second nonwoven fabric 13 is overlapped on the IC chip 1 and the coil 2. Then, a top force 14 is pressed from the upper part of the second nonwoven fabric 13 and the first and second nonwoven fabrics 12, 13, the IC tip 1 and the coil 2 are integrated by a hot press. |
