发明名称 Apparatus for cooling multiple printed circuit board mounted electrical components
摘要 An electrical component, mounted for example to a printed circuit board, is enclosed in a sealed chamber with an inert gas that permits the electrical leads of the electrical component to be formed from a material having high heat and electrical conductivity, such as silver, that is protected from corrosion and/or oxidation by the inert gas. The housing is fabricated from a heat conductive material, and heat is thereby drawn from the electrical leads for dissipation by the outer surface of the housing.
申请公布号 US5959840(A) 申请公布日期 1999.09.28
申请号 US19970882677 申请日期 1997.06.25
申请人 TANDEM COMPUTERS INCORPORATED 发明人 COLLINS, TOM W.;AVERY, WILLIAM J.;SUY, JOHN S.;TICHANE, DAVID M.
分类号 H05K3/32;H05K7/10;(IPC1-7):H05K7/20 主分类号 H05K3/32
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