发明名称 |
Apparatus for cooling multiple printed circuit board mounted electrical components |
摘要 |
An electrical component, mounted for example to a printed circuit board, is enclosed in a sealed chamber with an inert gas that permits the electrical leads of the electrical component to be formed from a material having high heat and electrical conductivity, such as silver, that is protected from corrosion and/or oxidation by the inert gas. The housing is fabricated from a heat conductive material, and heat is thereby drawn from the electrical leads for dissipation by the outer surface of the housing.
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申请公布号 |
US5959840(A) |
申请公布日期 |
1999.09.28 |
申请号 |
US19970882677 |
申请日期 |
1997.06.25 |
申请人 |
TANDEM COMPUTERS INCORPORATED |
发明人 |
COLLINS, TOM W.;AVERY, WILLIAM J.;SUY, JOHN S.;TICHANE, DAVID M. |
分类号 |
H05K3/32;H05K7/10;(IPC1-7):H05K7/20 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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