| 摘要 |
An air flow heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat exchange duct configured to thermally couple to an electronic component. The first heat exchange duct may be brought into and removed from a mated position with a forced air mechanism. When mated with the forced air mechanism, the forced air mechanism is positioned so as to increase airflow through the first heat exchange duct.
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