| 发明名称 |
Thermal sensor assembly |
| 摘要 |
An infrared thermal sensor assembly for sensing the temperature of a target, the sensor assembly including a heat sink having a bore therethrough; a thermopile housed in the bore; and a heater operative to heat the heat sink.
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| 申请公布号 |
US5957582(A) |
申请公布日期 |
1999.09.28 |
| 申请号 |
US19970953909 |
申请日期 |
1997.10.20 |
| 申请人 |
OUTPUT TECHNOLOGY CORPORATION |
发明人 |
GILLEN, JOHN;CASPER, ROBERT |
| 分类号 |
G01J5/00;G01J5/02;G01J5/06;G01J5/12;G01J5/16;G03G15/20;G03G21/20;(IPC1-7):G01J5/12;G01J5/08;G01J5/04 |
主分类号 |
G01J5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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